Fit Precision Mold not only helps customers produce product housings and plastic components, but also supports PCB prototyping and PCB manufacturing services.
Whether you are creating, testing, or developing an electronic hardware product, we can help simplify the process through rapid PCB layout support, PCB prototyping, and SMT assembly services.
Millions of circuit boards are produced every year for industries such as automotive electronics, medical electronics, power communication, industrial automation, and smart home applications. SMT has become one of the most important technologies in modern PCB manufacturing because it supports efficient, accurate, and high-volume assembly.
Our SMT assembly process includes
1. Material Preparation and Inspection
SMC components and PCB boards are prepared and checked before production begins. The PCB usually contains flat copper pads plated with tin-lead, silver, or gold, which serve as the soldering areas for component mounting.
2. Stencil Preparation
A stencil is used to define the solder paste printing locations. It is manufactured according to the layout and position of the solder pads on the PCB.
3. Solder Paste Printing
Solder paste, which is usually a mixture of flux and metal alloy powder, is printed onto the PCB through the stencil. This process deposits the correct amount of paste onto each solder pad before component placement.
4. SMC Placement
After solder paste printing, the PCB moves to the pick-and-place machine. The electronic components are automatically placed onto the board in their designated positions.
5. Reflow Soldering
After the components are mounted, the board enters the reflow soldering oven.
Preheat Zone: The board and components are heated gradually, typically at a rate of 1.0°C to 2.0°C per second, until the temperature reaches about 140°C to 160°C.
Soak Zone: The board remains at around 140°C to 160°C for approximately 60 to 90 seconds. This helps stabilize the temperature and prepare the solder paste for reflow.
Reflow Zone: The temperature continues to rise at about 1.0°C to 2.0°C per second until it reaches a peak of about 210°C to 230°C. At this stage, the solder melts and forms reliable joints between the component leads and the PCB pads.
Cooling Zone: The board is cooled in a controlled way so the solder solidifies properly and joint defects can be minimized.
If the PCB is double-sided, the printing, placement, and reflow process may be repeated using solder paste or adhesive, depending on the assembly requirements.
6. Cleaning and Inspection
After soldering, the boards are cleaned and inspected for any defects. If necessary, rework or repair is carried out before the products are stored or shipped. Common SMT inspection equipment includes magnifiers, AOI systems, flying probe testers, and X-ray inspection machines.
Whether you are a designer, engineer, OEM customer, or hardware developer, Fitmold is ready to support your PCB and SMT assembly needs and help turn your product ideas into reality.